The BioMEMS Resource Center provides services to the biomedical research community in a wide spectrum of technologies including microfluidics, micropatterning, and microdevices. The capabilities include silicon-, glass-, plastic-, and biomaterial-based microsystems.

Capabilities include the ability to provide the following services:

• Photolithography
• Soft Lithography
• Hot Embossing and Injection Molding
• Surface Chemistry and Characterization
• Cell Patterns and Arrays
• Microactuators and Microsensors
• Microfluidic Devices
• Computational Analysis

• Solvent Handling Fume Hood & Acid Handling Hood (Plastic Design, Inc., custom made)
  

The solvent handling hood is used for routine solvent use in steps like rinsing, photoresist developing, etc. The acid handling hood is the designated location for all acid use in the clean room. To facilitate processes such as piranha cleaning of silicon wafers, the acid handling hood is equipped with water baths for multiple rinsing cycles.

 

 

 

• Verteq SRD 840F Wafer Dryer
  This tool is used to dry silicon wafers following piranha cleaning.
  
  
• March Instruments PX-250 Plasma Asher
  (one each in the PDMS room and the clean room)
  
  
  
  
  
  
  
  
  
  
  
  
  
• Solitec 5110PD Spin Coater
  Used for positive photoresist coating (typically SU-8). This coater is equipped with a vacuum-based wafer holder to facilitate wafer transport from the coater to the hot plate.
  
  
  
  
  
  
  
  
  
  
• Machine World Spin Coater (custom built)
  Used for wafer coating with other materials, such as photosensitive PEG or PDMS.
  
  
• Despatch Industries CC1-11 Oven
  Used for positive photoresist curing.
  
  
• Lindberg VO-914A Oven
  This oven is maintained at 200 ºC and is used for dehydration of silicon wafers.
  
  
• Blue M Oven
  
  This oven is located in the PDMS room and maintained at 65 ºC to cure PDMS poured on top of patterned wafers.
  
  
  
  
  
  
  
  
  
  
  
• PMC 730A Digital Hot Plates
  
  There are two such hot plates in the clean room. These are used to bake silicon wafers coated with photoresist before and after exposure to UV. They are also used to bake the microfluidic devices after bonding PDMS to glass.
  
  
  
  
  
  
  
  
  
  
• Quintel Q2001CT Mask Aligner/Exposure System
  
  This aligner is used to expose photoresist-coated silicon wafers to 365 nm UV light. The typical power level is 11 mW/cm2.
  
  
  
  
  
  
  
  
  
  
  
• Veeco Dektak ST System Profilometer
  
  This surface profilometer is used to examine surface topography and feature height following exposure of wafers and development of photoresist.
  
  
  
  
  
  
  
  
  
  
  
• Kramer Corp. Olympus BX60 Microscope
  This microscope is used to inspect structures created after photoresist development and also to examine substrates.
  
  
  
  
  
  
  
  
  
  
• Kramer Corp. Combizoon-400 Microscope
  This microscope is used for inspection and also to align multiple layers of PDMS on top of one another for multi-layered devices.
  
  
• Kurt J. Lesker PVD75-KJ Sputtering System
  This tool is designed to sputter and deposit gold and chromium onto silicon wafers.